JPH0625982Y2 - 回路基板 - Google Patents
回路基板Info
- Publication number
- JPH0625982Y2 JPH0625982Y2 JP1988069225U JP6922588U JPH0625982Y2 JP H0625982 Y2 JPH0625982 Y2 JP H0625982Y2 JP 1988069225 U JP1988069225 U JP 1988069225U JP 6922588 U JP6922588 U JP 6922588U JP H0625982 Y2 JPH0625982 Y2 JP H0625982Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- printed resistor
- height
- chip
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988069225U JPH0625982Y2 (ja) | 1988-05-24 | 1988-05-24 | 回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988069225U JPH0625982Y2 (ja) | 1988-05-24 | 1988-05-24 | 回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01173964U JPH01173964U (en]) | 1989-12-11 |
| JPH0625982Y2 true JPH0625982Y2 (ja) | 1994-07-06 |
Family
ID=31294508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988069225U Expired - Lifetime JPH0625982Y2 (ja) | 1988-05-24 | 1988-05-24 | 回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625982Y2 (en]) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6554833B2 (ja) | 2015-03-12 | 2019-08-07 | 株式会社村田製作所 | 複合電子部品および抵抗素子 |
| JP2017005221A (ja) * | 2015-06-16 | 2017-01-05 | 株式会社村田製作所 | 複合電子部品 |
| JP6984688B2 (ja) * | 2015-06-16 | 2021-12-22 | 株式会社村田製作所 | 複合電子部品 |
| JP6696121B2 (ja) * | 2015-07-10 | 2020-05-20 | 株式会社村田製作所 | 複合電子部品および抵抗素子 |
| JP6582648B2 (ja) * | 2015-07-10 | 2019-10-02 | 株式会社村田製作所 | 複合電子部品 |
| JP6503943B2 (ja) * | 2015-07-10 | 2019-04-24 | 株式会社村田製作所 | 複合電子部品および抵抗素子 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5748294A (en) * | 1980-09-05 | 1982-03-19 | Tdk Electronics Co Ltd | Method of mounting electronic part |
| JPS57195867U (en]) * | 1981-06-04 | 1982-12-11 | ||
| JPS5846460U (ja) * | 1981-09-26 | 1983-03-29 | 株式会社リコー | 混成集積回路装置 |
| JPS59119794A (ja) * | 1982-12-27 | 1984-07-11 | 株式会社日立製作所 | 混成厚膜集積回路 |
| JPS59161675U (ja) * | 1983-04-15 | 1984-10-29 | 株式会社日立製作所 | 多層厚膜回路基板 |
| JPS6262586A (ja) * | 1985-09-12 | 1987-03-19 | シャープ株式会社 | プリント配線板 |
-
1988
- 1988-05-24 JP JP1988069225U patent/JPH0625982Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01173964U (en]) | 1989-12-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR860000188B1 (ko) | 혼성집적회로 부품 및 그 부착 방법 | |
| JPH0625982Y2 (ja) | 回路基板 | |
| JP2789406B2 (ja) | 回路基板 | |
| JPH0451064B2 (en]) | ||
| US5330825A (en) | Printed circuit substrate with projected electrode and connection method | |
| JP3061031B2 (ja) | プリント配線基板 | |
| JPH0378793B2 (en]) | ||
| JPH0458189B2 (en]) | ||
| JPS60140786A (ja) | チツプ型電子部品の実装構造 | |
| JPS62132396A (ja) | チツプ部品の実装方法 | |
| JPH0430566A (ja) | 高出力用混成集積回路装置 | |
| JPH02114595A (ja) | チップ部品の実装方法 | |
| JPS6230719B2 (en]) | ||
| JPH11163510A (ja) | 電子部品の実装構造 | |
| JP2960690B2 (ja) | 回路基板 | |
| JP2949252B2 (ja) | チップ形電子部品 | |
| JPS6236316Y2 (en]) | ||
| JPH1126910A (ja) | 電子部品のはんだ付け構造 | |
| JPH0430565A (ja) | 高出力用混成集積回路装置 | |
| JPH0727649Y2 (ja) | 放熱基板に取り付けられた抵抗体を備えた印刷配線板 | |
| JPS5856471U (ja) | チツプ部品の取付装置 | |
| JPH0410709Y2 (en]) | ||
| JPH0542803B2 (en]) | ||
| JPH05226518A (ja) | 混成集積回路装置 | |
| JPH0430459A (ja) | 高出力用混成集積回路装置 |